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Microvia PCB Design Rules That Prevent HDI Rework and Field Failures
High-density interconnect (HDI) boards depend on microvias to compress routing, escape fine-pitch ball grid arrays, and reduce layer counts. However, microvias are not simply scaled-down plated through holes. They are laser-ablated structures with tighter aspect ratios, smaller capture pads, and specific fill and cap requirements. Ignoring these constraints leads to Read more